page 1 formosa ms sfm21-bs thru sfm28-bs 1 2 2 2 2 3 4 4 4 5 6 6 7 list list................................................................................................. package outline............................................................................... features.......................................................................................... maximum ratings ............................................................................. rating and characteristic curves........................................................ pinning information........................................................................... marking........................................................................................... suggested solder pad layout............................................................. packing information.......................................................................... reel packing.................................................................................... suggested thermal profiles for soldering processes............................. high reliability test capabilities........................................................... mechanical data............................................................................... http://www.formosams.com/ tel:886-2-22696661 fax:886-2-22696141 document id issued date revised date revision page. ds-121442 2010/08/10 2011/07/22 b 7 chip super fast rectifiers
batch process design, excellent power dissipation offers better reverse leakage current and thermal resistance. low profile surface mounted application in order to optimize board space. high current capability. high surge current capability. glass passivated chip junction. features ? superfast recovery tim for switching mode application. lead-free parts meet rohs requirments. ? suffix "-h" indicates halogen free parts, ex. sfm21-bs-h. ? ? ? ? ? ? page 2 formosa ms 2.0a surface mount super fast rectifiers-50-600v parameter conditions forward rectified current forward surge current reverse current diode junction capacitance storage temperature see fig.2 8.3ms single half sine-wave (jedec methode) f=1mhz and applied 4v dc reverse voltage symbol min. typ. max. unit i o i fsm i r c j t stg a a a o c pf 2.0 50 5.0 +175 -65 v = v t = 25 c r rrm j o v = v t = 125 c r rrm j o 25 100 sfm21-bs sfm22-bs sfm23-bs 50 100 150 35 70 105 symbols v rrm (v) v rms v r (v) (v) *1 *2 *3 *1 repetitive peak reverse voltage *2 rms voltage *3 continuous reverse voltage *4 maximum forward voltage@i =2.0a *5 reverse recovery time f , note 1 maximum v f (v) *4 sfm24-bs sfm25-bs 200 300 140 210 1.70 -55 to +150 SFM26-BS sfm27-bs 400 500 280 350 35 50 100 150 200 300 400 500 0.95 1.25 sfm28-bs 600 600 420 (c) o operating temperature t, j http://www.formosams.com/ tel:886-2-22696661 fax:886-2-22696141 mechanical data epoxy:ul94-v0 rated flame retardant case : molded plastic, terminals : solder plated, solderable per mil-std-750, method 2026 polarity : indicated by cathode band mounting position : any weight : 0.072 gram ? ? ? ? ? ? do-214aa / smb-s approximated document id issued date revised date revision page. note 1. reverse recovery time test condition, if=0.5a, ir=1.0a, irr=0.25a 2. mounted on fr 4 pcb copper minimum recommended pad layout. -, sfm21-bs thru sfm28-bs package outline dimensions in inches and (millimeters) smb-s 0.220(5.6) 0.205(5.2) 0.020(0.5) typ. 0.138(3.5) 0.122(3.1) 0.075(1.9) 0.083(2.1) 0.067(1.7) 0.060(1.5) 0.040 (1.0) typ. 0.040(1.0) typ. t rr (ns) *5 ds-121442 2010/08/10 2011/07/22 b 7 maximum ratings and electrical characteristics (at t =25 a o c unless otherwise noted) typical thermal resistance r ja o c/w 37 junction to ambient , note 2 r jc 22 junction to case, note 2 chip super fast rectifiers
page 3 rating and characteristic curves (sfm21-bs thru sfm28-bs) fig.5-typical junction capacitance (+) (+) 25vdc (approx.) ( ) ( ) pulse generator (note 2) oscilliscope (note 1) 1 non- inductive notes: 1. rise time= 7ns max., input impedance= 1 megohm.22pf. 2. rise time= 10ns max., source impedance= 50 ohms. +0.5a 0 -0.25a -1.0a | | | | | | | | 1cm set time base for 50 / 10ns / cm trr d.u.t. fig.3- test circuit diagram and reverse recovery time characteristics 10 noninductive 50 noninductive reverse voltage,(v) junction cap acitance,(pf) 70 60 50 40 30 20 10 0 .01 .05 .1 .5 1 5 10 50 100 fig.4-maximum non-repetitive forward surge current http://www.formosams.com/ tel:886-2-22696661 fax:886-2-22696141 document id issued date revised date revision page. 0 20 10 30 50 40 number of cycles at 60hz 110 5 50 100 t =25 c j 8.3ms single half sine wave jedec method peak for ward surge current ,(a) ds-121442 2010/08/10 2011/07/22 b 7 fig.1-typical forward characteristics instantaneous for ward current ,(a) forward voltage,(v) .001 .01 .1 1.0 10 pulse width 300us 1% duty cycle t =25 c j 1.6 1.8 sfm25-bs~SFM26-BS sfm21-bs~sfm24-bs sfm27-bs~sfm28-bs .4 .6 .8 1.0 1.2 1.4 fig.2-typical forward current average for ward current ,(a) derating curve 2 1 . . 8 6 24 . 2 1 . . 0 2 .8 .4 0 0 20 40 60 80 100 120 140 160 180 lead temperature ( c)
formosa ms pinning information 1 2 pin1 cathode pin2 anode pin simplified outline symbol marking type number marking code sfm21-bs s21 sfm22-bs s22 sfm23-bs s23 sfm24-bs s24 sfm25-bs s25 SFM26-BS s26 sfm27-bs s27 sfm28-bs s28 page 4 http://www.formosams.com/ tel:886-2-22696661 fax:886-2-22696141 document id issued date revised date revision page. sfm21-bs thru sfm28-bs 1 2 suggested solder pad layout dimensions in inches and (millimeters) a c b b 0.059 (1.50) a 0.078 (2.00) c 0.110 (2.80) package smb-s ds-121442 2010/08/10 2011/07/22 b 7 chip super fast rectifiers
page 5 formosa ms http://www.formosams.com/ tel:886-2-22696661 fax:886-2-22696141 document id issued date revised date revision page. sfm21-bs thru sfm28-bs packing information item tolerance smb-s carrier width carrier length carrier depth sprocket hole 13" reel outside diameter 7" reel outside diameter 13" reel inner diameter 7" reel inner diameter feed hole diameter sprocket hole position punch hole position punch hole pitch sprocket hole pitch embossment center reel width overall tape thickness tape width p 0 p 1 e b c d f t w p a d d d 1 d 1 d 2 w 1 symbol 0.1 0.1 0.1 min min 0.5 0.1 0.3 1.0 0.1 0.1 0.1 0.1 0.1 0.1 2.0 2.0 unit:mm 1.50 330.00 178.00 50.00 62.00 13.00 1.75 5.50 8.00 4.00 2.00 0.23 12.00 18.00 p 0 p 1 e b d f w p a d d 1 d 2 w 1 c t note:devices are packed in accor dance with eia standar rs-481-a and specifications listed above. 3.81 5.74 2.24 ds-121442 2010/08/10 2011/07/22 b 7 chip super fast rectifiers
page 6 formosa ms http://www.formosams.com/ tel:886-2-22696661 fax:886-2-22696141 document id issued date revised date revision page. sfm21-bs thru sfm28-bs reel packing smb-s 4,000 8.0 8,000 337*337*37 330 382*356*392 88,000 17.0 package reel size reel component spacing box inner box reel dia, carton size carton approx. gross weight (kg) (pcs) (m/m) (m/m) (m/m) (pcs) (m/m) (pcs) 13" 1.storage environment: temperature=5 ~40 humidity=55% 25% 2.reflow soldering of surface-mount devices oo cc suggested thermal profiles for soldering processes profile feature soldering condition average ramp-up rate(t to t ) <3 /sec preheat -temperature min(tsmin) 150 -temperature max(tsmax) 200 -time(min to max)(t ) 60~120sec tsmax to t -ramp-uprate <3 /sec time maintained above: -temperature(t ) 217 -time(t ) 60~260sec peak temperature(t ) 255 0/ 5 time within 5 of actual peak temperature(t ) ramp-down rate <6 /sec time 25 to peak temperature <6minutes lp s l l l p p o o o o o oo o o o c c c c c c- + c c c c 10~30sec 3.reflow soldering critical zone tl to tp critical zone tl to tp tl tsmax tsmin ramp-up tp ts preheat t25 c to peak o time 25 tl tp ramp-down temperature ds-121442 2010/08/10 2011/07/22 b 7 chip super fast rectifiers
page 7 formosa ms http://www.formosams.com/ tel:886-2-22696661 fax:886-2-22696141 document id issued date revised date revision page. sfm21-bs thru sfm28-bs ds-121442 2010/08/10 2011/07/22 b 7 1. solder resistance 2. solderability 3. high temperature reverse bias 4. forward operation life 5. intermittent operation life 6. pressure cooker 7. temperature cycling 8. forward surge 9. humidity 10. high temperature storage life at 260 5 for 10 2sec. at 245 5 for 5 sec. v =80% rate at t =150 for 168 hrs. rated average rectifier current at t =25 for 500hrs. t = 25 c, i = i on state: power on for 5 min. off state: power off for 5 min. on and off for 500 cycles. 15p at t =121 for 4 hrs. -55 to +125 dwelled for 30 min. and transferred for 5min. total 10 cycles. 8.3ms single half sine-wave , one surge. at t =85 , rh=85% for 1000hrs. at 175 for 1000 hrs. c c c c c cc c c o o o o o oo o o rj a afo sig a a o mil-std-750d method-2031 mil-std-202f method-208 mil-std-750d method-1038 mil-std-750d method-1027 mil-std-750d method-1036 mil-std-750d method-1051 mil-std-750d method-4066-2 mil-std-750d method-1021 mil-std-750d method-1031 jesd22-a102 item test conditions reference high reliability test capabilities chip super fast rectifiers
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